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MosChip to showcase silicon-to-systems engineering at SEMICON India 2026

9 hours ago
By AI, Created 01:30 UTC, Sep 09, 2026, AGP -

MosChip Technologies will present its full-stack engineering services at SEMICON India 2026 in New Delhi from Sept. 17-19, 2026. The company plans live demonstrations of its smart energy meter IC and a Matter-enabled home automation bridge as it pitches capabilities from silicon design to AI-enabled intelligent systems.

Why it matters: - MosChip is using SEMICON India 2026 to position itself as a full-stack engineering partner, from silicon design through intelligent systems. - The showcase is aimed at customers seeking faster product development in areas such as analog and mixed-signal silicon, energy infrastructure, consumer devices and industrial systems. - The demos also highlight MosChip’s push into chiplets, packaging, test, embedded software, IoT and AI-enabled product development.

What happened: - MosChip Technologies will participate in SEMICON India 2026 in New Delhi from Sept. 17-19, 2026. - The company will show its capabilities across Turnkey ASIC, silicon design, IP services, hardware design, embedded software, IoT and AI solutions. - MosChip will be available for media interactions and customer briefings at the event. - Srinivasa Kakumanu, CEO and Managing Director, Manoj Nagesh, Director of Business Development, and technical leaders from the Silicon and Product Engineering divisions will be available.

The details: - MosChip plans to highlight RTL/Netlist-to-silicon Turnkey ASIC services for multi-billion-gate designs in advanced nodes for Edge AI, satellite navigation, HPC and consumer applications. - The company will also show application-specific ICs and boards developed for industrial domains. - A live demo of VIDYUT100 will showcase an indigenous smart energy meter IC designed and developed by MosChip from spec to silicon, along with software developed in-house. - VIDYUT100 integrates the DLMS/COSEM communication stack and supports real-time electricity metering, data acquisition and standardized communication for smart energy use. - MosChip will also demo its Product Xcelerate Blueprint: a Matter-enabled home automation bridge. - The reference design is pre-validated and is based on the Infineon platform, MosChip’s GenAIoT and AgenticSky solution accelerators. - MosChip describes the blueprint as a proof point for capabilities spanning hardware, embedded software, platform management, connectivity and agentic AI. - The company says its engineering expertise spans advanced technology nodes, chiplet architecture design, packaging, test and production workflows. - MosChip says it uses that expertise to help customers achieve first-pass success. - MosChip says its technical depth across multiple industry domains helps global customers accelerate time to market for analog and mixed-signal silicon solutions. - MosChip says it has more than 25 years of experience in Turnkey ASIC, silicon design, IP services, hardware engineering, embedded software development, cloud computing and AI solutions.

Between the lines: - The event presence is part product showcase and part business development pitch. - The live demos suggest MosChip wants to move the conversation beyond design services and toward complete productization support. - The emphasis on indigenous development, smart energy and Matter-enabled home automation points to demand for locally designed, standards-based connected hardware.

What's next: - MosChip will use the Sept. 17-19 event window to meet prospects, brief customers and present its engineering portfolio. - The company’s announcement directs readers to more information on its website. - MosChip also shared social channels including LinkedIn, X, Instagram, Facebook, YouTube, Bluesky and Pinterest.

The bottom line: - MosChip is signaling that its business is not just chip design, but a broader silicon-to-systems platform for customers building connected, intelligent products.

Disclaimer: This article was produced by AGP Wire with the assistance of artificial intelligence based on original source content and has been refined to improve clarity, structure, and readability. This content is provided on an “as is” basis. While care has been taken in its preparation, it may contain inaccuracies or omissions, and readers should consult the original source and independently verify key information where appropriate. This content is for informational purposes only and does not constitute legal, financial, investment, or other professional advice.

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